Kyocera 300 Module

Package

• Height:
  1.38 in (35.0 mm)
• Width:
  1.77 in (45.0 mm)
• Thickness:
  0.21 in (5.4 mm)
• Weight:
  0.35 oz (103 grams)

Regulatory Approval

• FCC ID:
  Pending
• IC:
  Pending
• CDG1 and 2:
  Pending
• RoHS Compliant
  

Operating Temperature

• -40° to +185°F (-40° to +85°C)*

*Designed to operate at -40° to +185°F (-40° to +85°C).

Environment Storage Temperature

• -40° to +185°F (-40° to +85°C)

Antenna Connectors

• Hirose UFL-R-SMT (50 Ohm) for CDMA applications

Power Supply

• +3.6V to +4.2VDC

Interface Connector
Molex 80-Pin slim stack B2B connector

• Power, Serial-UART 1 and UART 2
• Digital control
• GPIOs
• USB

Additional Tech Specs/Features:

• IS-2000 (CDMA2000 Release 0)-voice capacity and data throughput (as supported by the QSC6055™) targeted to support data rates of up to 153.6 Kbps on both the forward and reverse links
• IS-2000 (CDMA2000 Release 0)- MOB_P_REV6 radio configurations voice capacity and data throughput up to 153.6 Kbps on both the forward and reverse links
• IS-95A/IS-95B (JSTD-008) backward compatibility (MOB_P_REV1,3,4,5)
• 13K, QCELP and EVRC-B (4GV) vocoders
• TTY/TDD including operations in support of Telecommunications Act, Section 255
• TIA/EIA-683A; OTASP and OTAPA
• TIA/EIA-637A; two-way SMS
• TIA/EIA-707A; data service options, Packet Data and CSD
• TIA/EIA-835C; (TCP/IP/PPP) Simple IP and Mobile IP
• TIA/EIA-98E minimum RF performance
• Dual NAM support

• Enhanced AT Command Set
• Functions for over-the-air maintenance and management of software in the module
• Power Management
• Charging Control
• Full UDP/TCP/IP Stack with Server and client functions
• Programmable GPIOs
• AERIS® Digital Services
• BREW and Java
• DCTM, DMU, FOTA, IOTA and OTA-DM
• KMIP (Kyocera Multiplexed Interface Protocol)

Technical support to assist your engineering team in the integration of your solution.

• Assistance with integration, FCC and carrier acceptance

Module Developer Kit (MDK) (Optional) Includes:

• Interface board allows access to UART 1 and 2 and USB interface of the Module
• Programming kit
• Connectors for USB and serial cables, power adaptor, RF and B2B
• Software applications and programming tools
• Documentation
• Support Services

Note: Features and specifications are subject to change without notice.